Reflow Package QS-5180C

Desktop reflow QS5180C
  • Desktop reflow QS5180C

Small Desktop Lead-free Reflow Soldering Machine QS-5180C (Reflow Furnace) is a kind of desktop reflow soldering equipment for the production and maintenance of various products such as SMT. The small desktop lead-free reflow soldering machine QS-5180C is suitable for small batch SMT electronic products production, trial production, electronic product development, school training courses and other units




First, small desktop lead-free reflow soldering machine QS-5180C Product Description
    Desktop lead-free reflow soldering machine QS-5180C (reflow furnace) is a production and maintenance of SMT and other products of the desktop back welding equipment. The product uses high efficiency far infrared heating elements and distributed thermocouple temperature measurement device. Through the microcomputer's precise control, the temperature curve of the reflow furnace is controlled more accurately and the temperature of the weldback plane is more uniform. Fully adapted to a variety of different alloys and lead-free solder reflow requirements. The temperature curve is adjustable, in addition to the device also has automatic fault detection alarm, automatic shutdown and other functions. This product has a variety of applications such as reflow, repair, drying and so on. Small desktop lead-free reflow soldering machine QS-5180C suitable for small quantities of SMT electronic products production, trial production, electronic product development, school training and other units.
    Desktop lead-free reflow soldering machine QS-5180C operating software for the latest development of the Chinese operating system. Circuit structure on the use of efficient, convenient integration of the switching power supply, the use of high temperature aluminum silicate insulation cotton, in the performance of the structure and operation and other aspects of the improvement and upgrading.
Second, the desktop lead-free reflow QS-5180C main technical parameters 1, the input power: AC220V / (AC110V order)
2, the operating frequency: 50 ~ 60Hz
3, enter the maximum power: 1650W
4, infrared radiation and hot air mixing heating
5, the operating system: QS-5180C Chinese operating system
6, working mode: automatic reflow mode, adjustable constant temperature maintenance mode
7, the temperature curve section: preheat section, heating section, welding section, insulation section, cooling section of a total of five
8, preheat section temperature setting range and time: 70 ~ 150 ℃, time: 0 ~ 5min
9, heating section temperature setting range and time: preheat section temperature ~ 220 ℃, time: 0 ~ 5min
10, the welding section of the temperature range and time: heating section temperature ~ 300 ℃, time: 0 ~ 30s
11, the temperature of the temperature range and set the temperature: welding section temperature - (0 ~ 50 ℃)
12, tray specifications: 305x320mm
13, Dimensions: 460 × 372 × 275mm
Third, the desktop lead-free reflow soldering machine QS-5180C temperature curve of the role and function
    In the SMT production process, according to different alloy formulations of solder or tin slurry to adjust the temperature curve, but also to ensure that the product quality of a major parameter. Typical reflow typically has five temperature zones, and five temperature zones are typically set in a box-type reflow oven to simulate the five temperature zones of a tunnel reflow oven. In order to ensure that SMT PCB board different requirements, to design the temperature of the temperature range and the corresponding time. In order to better explain the requirements and functions of each temperature section, are divided into the temperature range to describe.
1: The purpose and function of the preheating section
The purpose is to heat the PCB board to 120-150 ℃ at room temperature, can fully volatilize the PCB board moisture, eliminate the PCB board internal stress and some residual gas, is the next temperature section of the gentle transition. Time is generally controlled at 1-5 minutes. The specific situation Kanban size and the number of components may be.
2: the purpose and role of heating section
Through the preheating section of the PCB board, is to be heated in the process of heating the tin paste in the flux, and in the role of flux to remove tin inside the surface and components of the oxide. Prepare for the welding process. At this stage, the temperature of the lead alloy solder and the precious metal alloy solder is usually set between 150 and 180 ° C, such as Sn 42% -Bi58% tin bismuth alloy low temperature lead-free solder, Sn43% -Pb43% -Bi14% Lead low temperature solder and so on. The medium-temperature leaded solder is generally set at 180-220 ° C. High temperature lead-free alloy solder is generally set between 220-250 ℃. If you use the brazing filler metal and tin paste on hand, the temperature of the heating section can be set at about 10 ° C below the melting point of the tin paste.
3: The purpose and function of the welding section
The main purpose of the welding section is to complete the SMT welding process, because this stage is in the whole process of the highest temperature rewound, very easy to damage the temperature requirements of the components. This process is also a perfect process of reflow soldering, the physical and chemical changes in the largest amount of solder, melting the solder is very easy in high temperature air oxidation. This stage is generally based on tin slurry information provided by the melting temperature of about 30-50 ℃ high. Whether lead or lead-free solder, we generally divided it into low-temperature solder (150-180 ℃), medium temperature solder (190-220 ℃), high temperature brazing filler metal (230-260 ℃). Now commonly used lead-free solder for high-temperature solder, low-temperature solder is generally precious metal lead-free solder and special requirements of low-temperature lead-free solder, in the common electronic products are relatively rare, and more for special requirements of electronic equipment The The lead in the medium temperature solder has excellent electrical properties, physical and mechanical properties, resistance to thermal shock performance, oxidation resistance. These properties of the current variety of lead-free solder can not be replaced, so in the general use of electronic products is also widely used.
The time of this phase is generally set according to the following requirements. Solder is shown in liquid at high temperature, and all SMT components float on the surface of the liquid solder. Under the action of flux and liquid surface tension, the floating components move to the center of the pad and are automatically aligned effect. In addition, under the wetting of the flux, the solder will form an alloy layer with the surface metal of the pre-treatment. Penetrate into the structure of the components inside the organization to form the ideal brazing structure, the time is generally located in about 10-30s, large area and a larger component shade of the PCB board should be set for a long time; small area of ​​the PCB parts The general set up a short time on it. In order to ensure the quality of reflow as much as possible to shorten the time of this stage, this is conducive to the protection of components.
4: the purpose and role of the insulation section
     The role of the insulation section is to make high-temperature liquid solder solidified into solid welding point, the quality of solidification directly affect the crystal structure and mechanical properties of solder, too fast solidification time will make the formation of crystalline solder rough, Physical performance decreased. In the high temperature and mechanical impact of the welding point is easy to crack the loss of mechanical connection and electrical connection, the product durability is reduced. We used to stop heating, with a warm temperature for a short time. Let the solder in the slow decline in the process of solidification and crystallization is good, the temperature is generally set at a lower than the solder melting point of about 10-20 ℃, the use of natural cooling time setting, down to this temperature point can enter the cooling section.
5: the purpose and function of the cooling section
The effect of the cooling section is relatively simple, usually cooling to the temperature can not be hot. But in order to speed up the operation process, you can drop to 150 ℃ below the end of the process. But remove the welding PCB board, use the tool or hand belt, temperature gloves removed to prevent burns.
6: Note Temperature curve is generally raised from low temperature, to meet the requirements of reflow as soon as possible to reduce the return welding temperature. It is also possible to reduce the temperature by appropriately extending the reflow time. This is conducive to the protection of low temperature components, connectors and connectors. Some components do not meet the temperature requirements, you can use the way to solve the welding.
4, desktop lead-free reflow soldering machine QS-5180C use precautions
1, please use more than 15A dedicated power outlet, do not share the same power outlet with other electrical appliances, and the power outlet must be reliable grounding. Reflow furnace should be placed horizontally, the surrounding wall should be more than 20cm gap.
2, do not use in the wet or high temperature environment reflow furnace.
3, do not use water directly flush the body, so as not to damage the insulation properties of the body.
4, do not insert wire or other foreign objects into the air inlet and outlet, to avoid burns or affect the ventilation and heat.
5, do not flammable, explosive dangerous goods near the back of the furnace; with flammable gas can not be dried items, so as to avoid danger.
6, please avoid collision with the body, so as not to damage the heating pipe, such as the discovery of heat pipe rupture, should turn off the power, and sent to repair.
7, work or the machine has not cooled to a safe temperature, do not put your hand into the chassis, so as not to burn.
8, do not put the reflow furnace put on the cloth to prevent the air inlet blockage.
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