QS-5180C reflow Package

QS-5180C reflow Package

QS-5180C reflow Package

Small SMT production line technology program
 
First, the production technology and production process
 
Chip technology: Dot solder / silk patch → Welding →
 
SMT Process: manual dispenser / manual screen printing machine → → Manual SMT reflow oven controller
 
Process Objective:
 
Point Solder: Through dispenser all the solder pads on the distribution
Screen printing: By printing machine and templates used in conjunction with all of the PCB SMD pads were missing on the solder paste.
Chip: With Chip Mounter tool or manually all the components correspond to the paste on the pads.
Soldering: Reflow solder paste using the heating, melting, cooling, and the pad between the components to form a good electrical connection.
Second, the equipment selection
1, the principle of selection
Throughout the SMT production lines, the correct choice of equipment can satisfy production requirements, improve production efficiency, reduce production costs, to ensure product quality, reduce wasteful investment. Typically, the choice of equipment generally consists of the following principles:
1). Practical principles
In the production process, we must first consider whether the selection of equipment to complete production tasks, to ensure product quality and the ability to cope in a range of production changes.
2) Reliability Principles
Reliability principles generally from three aspects to consider, first, the device can be sustained stability, low failure rate. Second, equipment performance, high precision, fully guarantee the product quality and reliable. Three is a good service.
3) Can the principle of development
Selection of equipment to have a larger space for the upgrade, in a relatively long period of time to meet the application of new technologies, and will not soon become obsolete.
4). The principle of economy
The principle of economy also consider two aspects, one is the device itself has a good price. Second, the device low energy consumption, save energy and reduce costs.
2, equipment selection
Dickens technology in the selection process of the program strictly complied with the above principles, the selected device and technical parameters are as follows:
 
(1) SMT solder paste mixing knife
Reflow Oven | Chip Mounter | SMD lines
Name: Paste mixing knife (Paste special mixing tool)
Material: Handle of wood materials, mixing of stainless steel.
Description: Used to stir solder paste, solder paste after mixing allows the ingredients evenly. Easy scraping tin operation.
 
(2) Manual printing table QS-2430
Reflow Oven | Chip Mounter | SMD lines
Solder paste printing is manually (SMT adhesive) were missing the PCB pads (pads middle), ready for the next step. Manual press is manually placed plates, positioning, printing, taking plates and stencil cleaning job.
Model Number: QS-2430
Printing area: 240mm × 300mm
Positioning mode: Edge positioning or hole location
Adjusting modes: manual tuning
Adjusting direction: front, left and right, up and down
Printing precision: 0.5mmPitch QTP
 
(3) SMT steel scraper
Reflow Oven | Chip Mounter | SMD lines
SMT solder paste stainless steel scraper blade
 
(4) vacuum suction pen QS-2008
Reflow Oven | Chip Mounter | SMD lines
    Accessories Description: a vacuum pump, two transparent hose, two aluminum pen tube, 2 cups (6MM), 3 Tsui withdrawing.
    Vacuum suction pen, can easily take four pin, double pin IC.IC pulling only.
   Artificial patch pen is a manual an important tool for surface mount technology, it is mainly artificial patch patch pen tip, through artificial patch pen self-generated air pressure difference (reverse vacuum), the chip components from Direct pick up the tape, and then manually placed in the corresponding components PADS bit, through the suction pressure has been adjusted, artificial patch pen sorptivity than solder paste (SMT adhesive) adhesion, components automatically placed in on the corresponding PADS.
   Another suction can be adjusted by adjusting the size of the switch to accommodate the weight of the components of different sizes.
   Artificial patch pen more stable than the traditional forceps and efficient. Artificial patch pen to take material directly from tape, to avoid waste components, both positive and negative elements and direction without problems, make the chip more efficient, while artificial patch pen directly adsorbed components on the back, avoiding forceps element edge bit devices, destruction pad bit, to avoid solder balling, and even the phenomenon of welding and soldering bridges. Moreover, the use of IC suction pen absorbing and releasing the back etc., to avoid the IC pin skew may cause false welding, welding and other related phenomena.
   Artificial patch pen and automatic SMT production lines with the use of shaped components for pick and place, the entire production line to improve the production efficiency of great significance. And with automatic SMT production line, for small batch production or testing and the use of tension is not a good alternative.
  An artificial placement machine, pneumatic suction pen, small size, easy to use, can be adjusted volume size, they can be used simultaneously.
  2 pick for SMT components and installation
 
(5) Three slots feeding rack
Reflow Oven | Chip Mounter | SMD lines
With artificial patch pen to use, can be hung on the feed rack discoid components directly from the feed tray paper tape through artificial patch pen drawing chip components, without the bulk strip off, helps to reduce process improve workers' speed pick and place components; same time as the material components used on the disc does not have vacuum packing tape, and can control the number of components missing element metal contacts to prevent oxidation during welding can effectively prevent the oxidation of the components produced Weld phenomenon.
 
(6) Desktop free reflow machine QS-5180C
Reflow Oven | Chip Mounter | SMD lines
One, desktop free reflow machine QS-5180C Product Description
    Desktop free reflow machine QS-5180C (reflow oven) is a method for the production and maintenance of SMT and other technology products for desktop reflow equipment. The product uses high efficiency infrared heating elements and distributed thermocouple devices. By precise control of the microcomputer, the reflow temperature profile control is more precise and reflow temperature more uniform plane. Fully adapt to a variety of different alloys and lead-free solder reflow requirements. Its precision adjustable temperature curve, in addition to the device also has an automatic fault detection and alarm, automatic shutdown feature. This product has reflow, repair, drying and other purposes. Suitable for small quantities of SMT electronics production, prototype, electronic product development, training schools and other units are used.
 
    Desktop free reflow machine QS-5180C operating software is the latest development in the bilingual operating system. Circuit structure using efficient and convenient integrated switching power supply, environmental protection aluminum silicate heat insulation cotton, in performance of the structure and operation of the parties to the surface was modified and upgraded.
 
Second, desktop free reflow machine main technical parameters of QS-5180C
 
1, input power: AC220V / (AC110V Order)
2, the operating frequency: 50 ~ 60Hz
3, the maximum input power: 1650W
4, infrared radiation and hot air mix heating
5, the operating system: QS-5180C bilingual operating system
6, the working modes: automatic reflow mode, maintenance mode adjustable thermostat
7, the temperature curve segment: preheating section, heating section, welding section, insulation segment, a total of five sections of the cooling section
8, preheating temperature and time setting range: 70 ~ 150 ℃, time: 0 ~ 5min
9, the heating zone temperature setting range and time: preheating temperature ~ 220 ℃, time: 0 ~ 5min
10, the welding zone temperature setting range and time: The proper temperature ~ 300 ℃, time: 0 ~ 30s
11, heat and time zone temperature setting range: Welding zone temperature - (0 ~ 50 ℃)
12, the tray size: 305x320mm
13 Dimensions: 460 × 372 × 275mm
 
Third, the desktop machine QS-5180C lead-free reflow temperature profile role and function
    The SMT production process, according to different alloy solder and solder paste formulation to adjust the temperature profile, but also to ensure high quality products a key parameter. Typical reflow usually has five temperature zones, and in the box type reflow furnace temperature is usually set five segments to simulate tunnel reflow furnace five temperature zones. In order to ensure the different requirements of SMT PCB board, to design the respective temperature ranges and the corresponding time temperature point. To better illustrate the requirements of the various temperature ranges and the role of the temperature ranges is described separately.
 
1: The purpose and effect of preheating section
Aimed at room temperature the PCB board is heated to 120-150 ℃, the PCB can be sufficiently volatile to water, to eliminate the internal stress and the PCB board part of the residual gas, is the next section of the smooth transition temperature. Time is generally controlled at 1-5 minutes. Specific situation kanban size and components may be.
 
2: The purpose and effect of the heating section
By preheating treated PCB, is to activate the process of heating section of solder paste flux and solder paste flux to remove the role and components inside surface oxides. Prepare for the welding process. At this stage and lead alloy solder metal alloy solder temperature is usually set at between 150-180 ℃, such as Sn42%-Bi58% low-temperature lead-free Sn-Bi alloy solder, Sn43%-Pb43%-Bi14% leaded solder temperature and so on. The temperature of a lead alloy solder generally set at 180-220 ℃. High-temperature lead-free solder alloys generally set at between 220-250 ℃. If you have on hand and tin solder paste with the information, the temperature of the heating section can be set lower than the melting temperature of solder paste point about 10 ℃ for the best.
 
3: The purpose and effect of welding section
The main purpose of welding section of SMT soldering process to complete, because at this stage in the reflow soldering process is the most high-temperature section, very easy to damage the components reach the temperature required. This process is a process of improvement reflowed solder physical and chemical changes of the largest, the solder melts very easily oxidized in air at elevated temperatures. This phase is generally based on information provided by solder paste melting temperature around 30-50 ℃. Regardless of leaded or lead-free solder, we generally put it into low temperature solder (150-180 ℃), the temperature solder (190-220 ℃), high temperature brazing (230-260 ℃). Now widely used for the high-temperature lead-free solder solder, solder temperature is generally precious and special requirements of lead-free solder lead solder at low temperature, in general electronic products is relatively rare, and more for the special requirements of electronic equipment . While the temperature of lead solder has excellent electrical properties, mechanical properties, resistance to thermal shock resistance, oxidation resistance. These properties present a variety of lead-free solder can not replace, so in general is also widely used in electronic products.
 
The time of this stage is generally carried out according to the following set several requirements. Melting the solder at a high temperature is displayed as the liquid, all of the SMT components will float on the liquid surface of the solder, flux, and the surface tension of the liquid, the float will move the component to the center of the pad, there will be automatic Reformed effect. Also in flux solder will wet down the surface of the case and pre-formed metal alloy layer. Penetrate into the tissue inside the element structure, form the desired structure of the solder, time is generally about 10-30s in a large area and a larger component side of the PCB board shade should be set to a longer time; small area of ​​the small part of the PCB board General Settings short time on it. To ensure the quality reflow stage as possible to shorten the time, this will help protect the components.
 
4: The purpose and effect of insulation segment
     Insulation section is to allow the temperature of liquid solder solidified into a solid weld solidification quality directly affects the crystal structure of the solder and mechanical properties, fast setting time will form crystals rough solder, solder joints are not smooth, mechanical Physical performance. At high temperatures and mechanical solder joints is easy to crack under the impact of mechanical and electrical connections to lose effect, reduced durability of the product. We use the heating was stopped by the short time with residual heat insulation. Slow decline in the temperature of the solder during solidification and well crystallized, the temperature set points are generally lower than the melting point of the solder around 10-20 ℃, the use of natural cooling time is set, the temperature dropped to this point can be entered after the cooling section.
 
5: The purpose and effect of the cooling section
The role of the cooling section is relatively simple, is typically cooled to a temperature not scalding it. To expedite the operation process, can be decreased to below 150 ℃ ends the process. But removing soldered PCB board, use tools or by hand with, heat gloves removed to prevent burns.
 
6: General Considerations temperature curve starting from low tone, to meet requirements after reflow reflow temperature as low as possible. Can extend through the appropriate time to reduce the temperature reflow soldering. Such protection is not conducive to the low-temperature heat resistance components, connectors, and connectors. Some components did not meet temperature requirements, can be used to resolve after welding.
 
Four, desktop free reflow machine QS-5180C Precautions
 
1, please use the 15A or more separate dedicated power outlet with other electrical appliances do not share the same power outlet and the power outlet must be grounded. Reflow oven should be placed horizontally, and the wall surrounding the gap should be more than 20cm.
2, do not damp or high temperature environments reflow oven.
3, do not direct wash water body, so as not to damage the body's insulation properties.
4, do not wire and other foreign objects into or block the intake and exhaust ports, to avoid burns or affect ventilation.
5, do not inflammable and explosive dangerous goods close to the reflow oven; gun with flammable gases items can be dried to avoid danger.
6, avoid colliding body, so as to avoid damage to the heat pipe, heat pipe rupture is found, you should turn off the power, and sent to repair.
7, at work or machine has not cooled to a safe temperature, do not reach into the chassis to avoid burns.
8, do not put the tablecloth reflow oven used to prevent air inlet blockage.

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